Abstract: In three-dimensional integrated circuits (3D-ICs), through silicon via (TSV) is a critical technique in providing vertical connections. However, yield is one of the key obstacles to adopt ...

Master Midjourney V7 for architectural visuals in 2025 with a clear, step-by-step workflow. Learn how to structure effective prompts, refine and upscale renders, maintain clean geometry, and turn ...

Abstract: Research that applies artificial intelligence (AI) to generate the captions for an image has been extensively studied in recent years. However, the length of these captions was short, and ...