Abstract: For the packaging and integration of millimeter-wave monolithic integrated circuits, a fan-out wafer-level package (FOWLP) technology is developed. TMV arrays and molybdenum copper blocks ...

Abstract: In this paper, we present a groundbreaking largescale system technology that leverages optimization on global, node, and device levels to achieve unprecedented scalability for tensor ...

In the field of stored ions, there are three research groups at our institute that concentrate their work on different focal ...