TEOS 3D offers ultra-thick inter-die gapfill by leveraging bowed wafer handling and advancements in dielectric deposition.

Called the Vector TEOS 3D, Lam said the tool will be required for applications like AI and high-performance computing (HPC) ...

KnowBe4 Defines a Holistic Approach to Human Risk ManagementKnowBe4’s new HRM framework guides organizations to transform employees into an active layer of defense through data-driven insights, ...

Open vocabulary recognition and classification are crucial for a comprehensive understanding of real-world 3D scenes.

However, effectively integrating semantic understanding into 3DGS in a generalizable way remains a challenge. To overcome these bottlenecks, we introduce SceneSplat, the first end-to-end large-scale ...

Abstract: Three-phase, four-wire, three-level inverters may experience high zero-sequence current in neutral wire, due to mechanical delays in switching devices, and load or system imbalances in ...

The engineering landscape is shifting fast. Technologies keep evolving, and industries now want engineers who don’t just know ...

Abstract: A theoretical design is presented for a mode coupler that enables efficient transmission of energy from a metallic rectangular waveguide to a 3D layer-by-layer PC waveguide over a wide ...

The two agreements include purchase of Velo3D's large-format Sapphire XC printer and establishing a service agreement in support of key research and development, qualification, and part fabrication ...