TEOS 3D offers ultra-thick inter-die gapfill by leveraging bowed wafer handling and advancements in dielectric deposition.

Called the Vector TEOS 3D, Lam said the tool will be required for applications like AI and high-performance computing (HPC) ...

D/AVE HD is a cost-efficient, highly configurable IP core for 2D and 3D graphics applications. The variants of the core are available for FPGAs, ASICs ...

The Roewe M7 DMH is the first mass-produced vehicle in SAIC Roewe's "Pearl" series, positioned as a mid-to-large hybrid sedan. This model is designed by former Rolls-Royce designer Joseph Kaban, ...

Open vocabulary recognition and classification are crucial for a comprehensive understanding of real-world 3D scenes.

Yesterday was Patch Tuesday for September, and Microsoft provided security updates that address 80 new vulnerabilities.

The two agreements include purchase of Velo3D's large-format Sapphire XC printer and establishing a service agreement in support of key research and development, qualification, and part fabrication ...

Anritsu Corporation, a global provider of communication technologies and measurement solutions, will have a strong presence ...

New Predator desktops, monitor, and keyboard deliver elite performance and cutting-edge features for gamers Acer has ...

This study offers a valuable theoretical framework for quantifying molecular transport across interfaces between coexisting liquid phases, emphasizing interfacial resistance as a central factor ...