Has Qwen 2.5 Max perked your interest? Here is everything you need to know about Qwen 2.5 Max, its unfiltered version and how ...

Featuring a compact high heat dissipation design, the new SiC molded modules set a new standard for OBCs. ROHM Semiconductor has introduced a new line of 4-in-1 and 6-in-1 silicon carbide (SiC) molded ...

u-blox has recently announced the world’s smallest L1, L5 dual-band GNSS module with an integrated patch antenna for precise meter-level positioning in applications such as asset tracking, telematics, ...

The next decade is expected to see strong growth in the global usage of electric vehicles. As the charging infrastructure is developed and battery costs reduced, EVs are expected to dominate the ...

Cybersecurity researchers have called attention to a software supply chain attack targeting the Go ecosystem that involves a malicious package capable of granting the adversary remote access to ...

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Moving forward on the ‘More than Moore’ roadmap. We’re witnessing a rapid evolution in advanced semiconductor nodes and market growth due to the meteoric rise of AI, mobile, autonomous automotive, IoT ...

Abstract: This paper studies the reliability of high power module package in torque mounting assembly process and temperature cycling reliability by simulation. The power module package, which with ...

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

Jean-Luc noted the MemryX MX3 edge AI accelerator module while covering the DeGirum ORCA M.2 and USB Edge AI accelerators last month, so today, we’ll have a look at this AI chip and corresponding ...