TEOS 3D offers ultra-thick inter-die gapfill by leveraging bowed wafer handling and advancements in dielectric deposition.

Called the Vector TEOS 3D, Lam said the tool will be required for applications like AI and high-performance computing (HPC) ...

Yesterday was Patch Tuesday for September, and Microsoft provided security updates that address 80 new vulnerabilities.

KnowBe4 Defines a Holistic Approach to Human Risk ManagementKnowBe4’s new HRM framework guides organizations to transform employees into an active layer of defense through data-driven insights, ...

Open vocabulary recognition and classification are crucial for a comprehensive understanding of real-world 3D scenes.

However, effectively integrating semantic understanding into 3DGS in a generalizable way remains a challenge. To overcome these bottlenecks, we introduce SceneSplat, the first end-to-end large-scale ...

Abstract: Three-phase, four-wire, three-level inverters may experience high zero-sequence current in neutral wire, due to mechanical delays in switching devices, and load or system imbalances in ...

Abstract: A theoretical design is presented for a mode coupler that enables efficient transmission of energy from a metallic rectangular waveguide to a 3D layer-by-layer PC waveguide over a wide ...

The two agreements include purchase of Velo3D's large-format Sapphire XC printer and establishing a service agreement in support of key research and development, qualification, and part fabrication ...