资讯
0 comments on “ 3-D bin packing algorithm proposed for SoC testing ” Leave a Reply You must Sign in or Register to post a comment.
In their paper, the authors proposed a new method, called restricted 3-D bin packing, to accommodate the peak power constraint. The method simultaneously allows selection of an optimal wrapper width ...
当前正在显示可能无法访问的结果。
隐藏无法访问的结果